Binary half tone photomasks and microscopic three-dimensional devices and method of fabricating the same

ABSTRACT

The present invention generally relates to improved binary half tone (“BHT”) photomasks and microscopic three-dimensional structures (e.g., MEMS, micro-optics, photonics, micro-structures and other three-dimensional, microscopic devices) made from such BHT photomasks. More particularly, the present invention provides a method for designing a BHT photomask layout, transferring the layout to a BHT photomask and fabricating three-dimensional microscopic structures using the BHT photomask designed by the method of the present invention. In this regard, the method of designing a BHT photomask layout comprises the steps of generating at least two pixels, dividing each of the pixels into sub-pixels having a variable length in a first axis and fixed length in a second axis, and arraying the pixels to form a pattern for transmitting light through the pixels so as to form a continuous tone, aerial light image. The sub-pixels&#39; area should be smaller than the minimum resolution of an optical system of an exposure tool with which the binary half tone photomask is intended to be used. By using this method, it is possible to design a BHT photomask to have continuous gray levels such that the change in light intensity between each gray level is both finite and linear. As a result, when this BHT photomask is used to make a three-dimensional microscopic structure, it is possible to produce a smoother and more linear profile on the object being made.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.10/349,629, filed Jan. 23, 2003.

FIELD OF THE INVENTION

The present invention generally relates to binary half tone (“BHT”)photomasks and three-dimensional microscopic structures (e.g.,micro-electromechanical systems (“MEMS”), micro-optics, photonics,micro-structures, imprint lithography applications and other devices)and a method for designing and fabricating the same.

BACKGROUND OF THE INVENTION

Recent technological advances have made it possible to usethree-dimensional MEMS, micro-optical devices and other micro-structuresin a variety of fields, including photonics, communications, andintegrated circuits. In the past, these tiny devices were fabricatedusing laser micro-machining tools. However, this method was timeconsuming and expensive, and thus, it was typically difficult formanufacturers to meet production requirements in a cost efficientmanner. In this regard, such techniques did not work well with commonlyapplied techniques for manufacturing integrated circuits because eachpixel of the design had to be rewritten using a new algorithm. Sincethis was a laborious and time-consuming undertaking, many have avoidedthe use of micro-machining tools.

In light of the desirability to use small scale, three-dimensionalstructures, other manufacturing techniques have been developed in anattempt to avoid the problems associated with laser micro-machiningtools. In particular, traditional optical lithography techniques usedfor fabricating integrated circuits have been adapted to manufacturethree-dimensional microstructures. In traditional optical lithography, afully resolved pattern is etched into a binary photomask and transferredto a wafer by exposing the wafer through an exposure tool (e.g.,stepper). More particularly, binary photomasks are typically comprisedof a substantially transparent substrate (e.g., quartz) and an opaquelayer (e.g., chrome) in which the pattern to be transferred is etched.It is also known that other layers may be included on the photomask,including, for example, an antireflective layer (e.g., chrome oxide).The photoresist in the substrate on the integrated circuit beingprocessed is then developed and either the exposed or unexposed portionsare removed. Thereafter, the material on the substrate is etched in theareas where the photoresist is removed. An example of the technologyinvolved in manufacturing a traditional binary photomask (e.g.,chrome-on-quartz) and its use to manufacture integrated circuits isdisclosed in, for example, U.S. Pat. No. 6,406,818.

These known processes for fabricating binary photomasks andsemiconductor devices have been modified for the manufacture ofthree-dimensional, microscopic devices. In this regard, it is known touse a continuous tone pattern on the photomask (e.g., chrome-on-glass)instead of a binary, fully resolved mask pattern to yield a continuoustone intensity through the photomask during image formation. One type ofcontinuous tone, variable transmission photomask is commonly known as abinary half tone (“BHT”) photomask. BHT photomasks use two levels ofgray tones (e.g., 0% transmissive and 100% transmissive). Another typeof continuous tone, variable transmission photomask is known as grayscale photomasks, which use varying levels of transmission of lightthrough the photomask (e.g., 0%, 50%, 100%, etc.). By using these typesof variable transmission photomasks, a three-dimensional structure canbe formed in the photoresist on a wafer through the use of a continuoustone pattern.

BHT photomasks are typically designed to have sub-resolution featuresthat partially transmit exposure source light intensity based on featuremodulation in width and pitch. In this regard, it is known in the art todesign a BHT photomask layout for microscopic surfaces by dividing thepatterned area of the photomask into pixels and sub-pixels (commonlyreferred to as “sub-pixelation”) which define areas on the mask throughwhich light is to be transmitted, as shown in FIGS. 1 and 2. Thesub-pixels defining the BHT photomask pattern are designed to be smallerthan the resolution of the exposure tool being used so that a gray scaleimage can be created on the resulting wafer. The boundaries of thesub-pixel's size are typically defined by Rayleigh's equation (1) asfollows:R=kÿ/NA   (1)where R is the minimum resolvable half pitch feature of the wafer, ÿ isthe exposure tool wavelength, NA is the numerical aperture of theoptical system of the exposure tool being used and k (k factor) is aunitless constant whose value depends on process capability (e.g., thesmaller the k factor, the better low contrast aerial images can beseen). Generally speaking, the sub-pixels that are required by grayscale designs need to be unresolved in the imaging system, and thus, thek factor should preferably be less than 0.5. As a practical matter,however, the k factor can be somewhat greater than 0.5 and still beunresolved by the total process for some exposure tools. Photomaskdesigners have used calibrated simulation tools, such as the Prolith/2manufactured by KLA-Tencor, to converge on the optimum unresolvablefeature size. Unfortunately, there are many other tools which do notmeet the requirements of equation (1), and thus, the design of thephotomask is often limited by the capabilities of the design toolsavailable to the designer. Moreover, since photomasks are commonlydesigned to include other structures (e.g., two dimensional, binarycomponents such as integrated circuit patterns) in addition to athree-dimensional device (e.g., photonics application), this problem iseven more complex than implied by the above equation. In such cases,certain BHT cell designs may involve isolated spaces in chrome or chromeislands on the mask and the notion of half pitch is not defined.

As understood by those skilled in the art, tolerable surface roughnesseffects the minimum feature size in the device under fabrication. Forexample, where the k factor is 0.7 in equation (1) (i.e., the minimumfeature size is resolvable by the optical system), an attempt toconstruct a BHT photomask having a step-ramp layout will result in asub-ripple within each step of the ramp pattern, as shown in FIG. 3. Insome applications where the specifications of the device permit, aripple-effect may be acceptable, albeit undesirable. However, in manyapplications, a sub-ripple effect is not acceptable since a smootherprofile is needed for optimal performance of the device beingfabricated. Since the prior art BHT photomask design requires the use ofa small k factor to achieve a smoother profile, the mask designer islimited to equipment meeting this requirement.

In addition to the k factor, the design of a BHT photomask layout isgoverned by other specifications of the optical lithography equipmentbeing used, including, for example, its resolution, magnification,wavelength, etc. In this regard, known gray scale applications, such asmicro-optical surface generation, require data to have a higherresolution than what is typical of most mask pattern generators. As aresult, the mask designer is limited to only those write tools that havethe ability to match the gray level grid design associated therewith.For example, an electron beam write tool such as the MEBES 4500, with awrite grid of 20 nm cannot properly replicate a BHT design whosesub-pixel variations is 10 nm. A laser beam write tool, by contrast,such as the ALTA 3500 having a write address of 5 nm is capable ofreplicating the same design.

Moreover, an imaging solution requiring custom materials at the maskwill often add cost and complexity in the overall manufacturing processdue to the difficulties typically associated with integrating newmaterials into a photomask. For example, it is known in the art to usevariable attenuating films (“VAF”), rather than a BHT photomask, to makethree-dimensional devices. However, VAFs are typically expensive andyield less than desirable results.

Once the mask pattern design is completed, the design is transferred tothe photomask using optical lithography methods similar to those used toprocess a conventional binary photomask, as shown in FIG. 4. Moreparticularly, a binary photomask having photoresist 51, chrome 53 andquartz 55 layers is placed under a photomask pattern generator. Thephotoresist layer 51 is exposed to an optical, laser, electron beam orother write tool in accordance with the data file defining the BHTphotomask. The exposed portions of the photoresist layer 51 aredeveloped (i.e., removed) to expose the underlying chrome portions ofthe chrome layer 53. Next, the exposed chrome portions are etched away(e.g., by dry plasma or wet etching techniques). Thereafter, theremaining photoresist 51 is removed to form a completed BHT photomask inaccordance with the BHT photomask layout.

The variable intensity gray tone pattern defined by the mask is nexttransferred to a wafer coated with photoresist using a wafer stepper orother optical lithography tools. More specifically, varying lightintensities are exposed to portions of photoresist on the wafer asdefined by the openings in the BHT photomask. The photoresist, in turn,exhibits changes in optical density and a gray scale profile is createdthereon. It is noted, however, that the photoresist process is oftenlimited to the variable dose pattern generator being used. Next, theexposed photoresist is removed and the remaining photoresist forms agray scale pattern which corresponds to the mask design. The photoresistand wafer are then etched to predetermined depths to conform to the grayscale pattern. The result is a three-dimensional micro-structure on thewafer.

In the known methods described above, the minimum feature size suitingthe needed application (e.g., three-dimensional microscopic structure)is determined through known simulation techniques, by experimentation orother methods. Once the minimum feature size is determined, a pixeldefining the mask dimensions is generated. Various methods have beenapplied to array a gray scale design (e.g., squares, pixels or spotsusing variable pitch and variable sub-pixelation methods). Thesemethods, however, have their limitations. In this regard, it is knownthat contact hole and spot features are more difficult to control thanline and space features. As a result, both corner rounding and linearityof the design are compromised. Similarly, variable pitch methods areproblematic since they require a different algorithm to be applied ateach pixel position to carefully define the correct opening in the BHTmask. When considering the dynamic range for the layout, the squarepixel changes non-linearly since the size is varied over the contactarea. This can limit the ability of a mask designer to make the finechanges required to correct for process non-linearity. These methods addto the costs and processing time in preparation of the mask since theyrequire a large number of adjustments to be made to the overall design.

One example of a known method for designing a BHT photomask is describedin U.S. Pat. No. 5,310,623 (“the '623 Patent’). The '623 Patent teachesa method for fabricating microlenses through the use of a singleexposure mask with precisely located and sized light transmittingopenings to enable an image replica to be produced in photoresistmaterials, and ultimately transferred to a substrate. As disclosed, thedesign for the photomask is generated using three-dimensional modelingsoftware, wherein a single pixel defines the shape of the microlens. Thesingle pixel is sub-divided into “sub-pixels”, which in turn aresub-divided into gray scale resolution elements. Each sub-pixel and grayscale resolution elements is designed to be “equal [in] size” on eachside. (Col. 6, line 30). In other words, each sub-pixel and gray scaleelement is a perfect square.

U.S. Pat. No. 6,335,151 discloses a method for fabricating amicroscopic, three-dimensional object by creating a mask havingconsisting of pixels and “super-pixels” which define the contours of theobject's surface, imaging the mask's pattern onto a photoresist film,and transferring the three-dimensional surface from the photoresist to asubstrate.

Although useful, the conventional square pixel array methods used in theprior art have their shortcomings. In this regard, the prior artdiscloses the use of square pixels having a size which is less than theminimum resolvable feature size of an optical system. Each pixel is thendivided into sub-pixels whose respective areas are changed in both the xand y axes, as disclosed in the '151 and '623 Patents. As a result, thechange in area of each sub-pixel is a square of the amplitude, therebymaking the change in light intensity between each gray level non-linearand often infinite. Thus, the transmission of light is limited by thesquare sub-pixel's size as well as the minimum dimensions permitted bythe mask pattern generator. Accordingly, three-dimensional objects madeby the prior art methods tend to have jagged surfaces, especially wherethe objects are sloped. Since these methods produce marginal results,many have migrated away from the use of BHT photomasks for makingthree-dimensional microscopic devices.

Thus, there is a long felt need for new design rules and layout choicesfor making BHT photomasks to overcome these shortcoming associated withthe prior art.

While the prior art is of interest, the known methods and apparatus ofthe prior art present several limitations which the present inventionseeks to overcome.

In particular, it is an object of the present invention to provide amethod for designing a BHT photomask layout having a smooth profile.

It is a further object of the present invention to provide a method fordesigning a BHT photomask layout which meets the specifications of awide range of optical systems.

It is another object of the present invention to design a BHT photomaskwherein the change in light intensity between each gray level is bothlinear and finite.

It is another object of the present invention to solve the shortcomingsof the prior art.

Other objects will become apparent from the foregoing description.

SUMMARY OF THE INVENTION

It has now been found that the above and related objects of the presentinvention are obtained in the form of a BHT photomask and microscopicthree-dimensional structure and method for designing and fabricating thesame. The method for designing the layout of BHT or gray scalephotomasks is governed by specific design rules calculated within anelectronic database.

More particularly, the present invention is directed to a binary halftone photomask comprising a substantially transparent substrate and anopaque layer having a pattern formed therein. The pattern is defined byat least one pixel, wherein each pixel is divided into sub-pixels havinga variable length in a first axis and fixed length in a second axis. Inone embodiment of the present invention, the pixel is a square and thesub-pixels have a height and a length, wherein th height of each of thesub-pixels is approximately one half of the pixel's pitch and the lengthof each sub-pixel is linearly varied in opposite directions along oneaxis only. In another embodiment, the pixel is circular and thesub-pixels have a radius and an arc length, wherein the radius of eachof the sub-pixels is approximately one half of the pixel's pitch and thearc length of each sub-pixel being linearly varied in oppositedirections along one axis only.

The present invention is also directed to a method for designing alayout of a binary half tone photomask pattern to be used to fabricate athree-dimensional structure. This method comprises the steps ofgenerating at least two pixels, dividing each of the pixels intosub-pixels having a variable length in a first axis and fixed length ina second axis, and arraying the pixels to form a pattern fortransmitting light through the pixels so as to form a continuous tone,aerial light image. In a preferred embodiment, the sub-pixel's area issmaller than the minimum resolution of an optical system of an exposuretool with which the binary half tone photomask is intended to be used.

Additionally, the present invention is directed to a method for making abinary half tone photomask. This method comprises the step of providinga binary photomask comprising a photoresist layer, an opaque layer and asubstantially transparent layer in a lithography tool. Additionally, thephotoresist layer is exposed to the lithography tool in accordance witha binary half tone photomask pattern on the photomask, wherein thepattern is defined by at least one pixel. Each pixel is divided intosub-pixels having a variable length in a first axis and fixed length ina second axis. Next, undesired portions of the photoresist and portionsof the opaque layer underlying the removed photoresist portions areetched. Thereafter, the remaining portions of the photoresist layer areremoved. Here again, each sub-pixel's area is preferably smaller thanthe minimum resolution of an optical system of an exposure tool withwhich the binary half tone photomask is intended to be used.

The present invention is also directed a microscopic three-dimensionalstructure made in accordance with the methods described above. In thisregard, the three-dimensional structure comprises a wafer having acontinuous tone, substantially linear and smooth surface, wherein thesurface of the wafer corresponds to the shape of a light aerial imagegenerated from a binary half tone photomask. The binary half tonephotomask comprises a pattern formed therein which is defined by atleast one pixel, wherein each pixel is divided into sub-pixels having avariable length in a first axis and fixed length in a second axis. Hereagain, each sub-pixel preferably has an area that is smaller than theminimum resolution of an optical system of an exposure tool with whichthe binary half tone photomask is intended to be used.

The present invention is also directed to a method for fabricating athree-dimensional microscopic structure in accordance with the methodsdescribed above. In this regard, the method for fabricating a threedimensional structure comprises the step of providing a binary half tonephotomask between an exposure tool and a wafer coated with a photoresistlayer. The binary half tone photomask comprises a substantiallytransparent substrate and an opaque layer having a pattern formedtherein. The pattern is defined by at least one pixel, wherein eachpixel is divided into sub-pixels having a variable length in a firstaxis and fixed length in a second axis. The sub-pixels' area ispreferably smaller than the minimum resolution of an optical system ofan exposure tool with which the binary half tone photomask is intendedto be used. Next, the photoresist layer of the wafer is exposed to theexposure tool in accordance with pattern on the binary half tonephotomask. Thereafter, undesired photoresist is removed to form athree-dimensional profile in the photoresist which has not been removed.Next, the wafer is etched to a predetermined depth to correspond inshape to the three dimensional profile formed in the remainingphotoresist. Thereafter, the remaining photoresist is removed.

In another embodiment of the present invention, a method for making stepand flash templates is provided. This method comprises the step ofproviding a binary photomask having a photoresist layer, an opaque layerand substantially transparent in a lithography tool. The photoresistlayer is exposed to a lithography tool in accordance with a binary halftone photomask pattern defined by at least one pixel, wherein each pixelis divided into sub-pixels having a variable length in a first axis andfixed length in a second axis. The sub-pixels' area is preferablysmaller than the minimum resolution of an optical system of an exposuretool with which the binary half tone photomask is intended to be used.Next, undesired portions of the photoresist is removed from thephotomask and portions of the chrome layer underlying the removedphotoresist portions are etched away. Thereafter, remaining portions ofthe photoresist layer are removed and the pattern in the binary halftone photomask is transferred to a second substrate to produce acontinuous tone pattern defined by the photomask thereon. The secondsubstrate is preferably made from a rigid material, including, but notlimited to, fused silica, glass, metals, crystalline structures,plastics or other similar materials. The second substrate may then beused as an imprinting or stamping plate for fabricating imprintlithography applications.

Another embodiment of the present invention is directed to a gray scalephotomask made in accordance with the methods described herein. The grayscale photomask comprises a substantially transparent substrate and anopaque layer having a pattern formed therein. The pattern is defined byat least one pixel, wherein each pixel is divided into sub-pixels havinga variable length in a first axis and fixed length in a second axis. Thesub-pixels' area is preferably smaller than the minimum resolution of anoptical system of an exposure tool with which the binary half tonephotomask is intended to be used.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and related objects, features and advantages of the presentinvention will be more fully understood by reference to the following,detailed description of the preferred, albeit illustrative, embodimentof the present invention when taken in conjunction with the accompanyingfigures, wherein:

FIGS. 1 and 2 illustrate examples of BHT photomask patterns known in theprior art;

FIG. 3 illustrates the ripple effect that results from a step-ramplayout designed in accordance with prior art sub-pixelation methods,such as those shown in FIGS. 1 and 2;

FIG. 4 illustrates the process of making BHT photomask pattern usingconventional lithography techniques;

FIGS. 5 a and 5 b show a square pixel divided into half-pitch sub-pixelswhose area is varied along one axis only in accordance with the methodof the present invention;

FIGS. 6 a and 6 b show a circular pixel divided into half-pitchsub-pixels whose area is varied along one axis only in accordance withthe method of the present invention;

FIG. 7 shows the surface roughness of a three-dimensional device as itrelates to photoresist thickness and the critical dimensions of thedevice;

FIG. 8 shows the dynamic range of BHT gray levels pixel sizes as afunction of photoresist contrast;

FIG. 9 shows a linear ramp design for a BHT photomask made in accordancewith the method of the present invention as shown in FIGS. 5 a and 5 b;

FIG. 10 is an SEM cross section of a printed BHT design on a wafer;

FIG. 11 shows an AFM profile of the photoresist slope of the ramp designshown in FIGS. 9 and 10;

FIG. 12 shows a simulated photoresist profile from the design of FIGS. 9and 13;

FIG. 13 shows circular ramp design for BHT photomask made in accordancewith the method of the present invention as shown in FIGS. 6 a and 6 b;

FIG. 14 is an AFM image of a lens array that was printed in accordancewith the ramp design shown in FIG. 13;

FIG. 15 shows a side view of one of the conical sections shown in FIG.14; and

FIG. 16 is a pixel having multiple sub-pixels arrayed therein.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention generally relates to improved BHT photomasks andmicroscopic three-dimensional structures made from such photomasks. Thepresent invention is also directed toward a method for designing andfabricating BHT photomasks to be used in creating such microscopicthree-dimensional structures (e.g., MEMS, micro-optics, photonics,micro-structures and other three-dimensional, microscopic devices). Moreparticularly, the present provides a method for designing a BHTphotomask layout, transferring the layout to a BHT photomask andfabricating three-dimensional microscopic structures using the BHTphotomask designed by the method of the present invention. As will beseen below, the method of the present invention enables a photomaskdesigner to design a BHT photomask to have continuous gray levels suchthat the change in light intensity between each gray level is bothfinite and linear. As a result, when this BHT photomask is used to makea three-dimensional microscopic structure, it is possible to produce asmoother and more linear profile on the object being made. Likewise, ithas been found that BHT photomasks designed in accordance with themethod of the present invention meet the sub-resolution requirements ofmost, if not all, optical tools. Each aspect of the present invention isnow described.

The first aspect of the present invention is directed to the method bywhich the design for a BHT photomask is generated. More particularly,the method of the present invention implements specific design rulescalculated within an electronic database to generate a photomask patternwhich achieves substantially linear changes in variable light intensitywhen transmitted through the photomask.

More particularly, the BHT photomask design method of the presentinvention uses a series of pixels, preferably either square or circular,whose area is varied in a manner so as to avoid the limitations of theresolution of the mask pattern generator being used. (While square orcircular pixels are preferred, the present invention is not so limited,and may apply to other shaped pixels, such as oval shaped, rectangular,etc.). In a preferred embodiment, a pixel 19 is generated such that itsarea is larger than the minimum resolution of the mask pattern generatorbeing used. Thereafter, each pixel 19 is divided into two half-pixels,such as sub-pixels 21 a and 21 b, as shown in FIGS. 5 a-b and 6 a-b.Each sub-pixel 21 a and 21 b has a height h (in the case of a squarepixel, see FIGS. 5 a-b) or radius r (in the case of a circular pixel,see, FIGS. 6 a-b), wherein the height h or radius r for each sub-pixel21 a and 21 b is a fixed length. In one embodiment, the height h orradius r of each sub-pixel 21 a and 21 b, as the case may be, is equalto approximately one-half of the pitch p of pixel 19. It is noted,however, that the height h or radius r (as the case may be) of thesub-pixels 21 a and 21 b can be divided into other fixed lengths,including, but not limited to, the following arrangements: height h orsub-pixel 21 a is one-third of the pitch of the pixel 19 and sub-pixel21 b is two-thirds of the pitch of pixel 19, or vice versa; height h orsub-pixel 21 a is one-fourth of the pitch of the pixel 19 and sub-pixel21 b is three-fourths of the pitch of pixel 19, or vice versa; etc. Inthis regard, the height h or radius r of each sub-pixel 21 a and 21 bshould be divided in a manner such that their total pitch, when addedtogether, is equal to the pitch of the pixel 19 from which they weredivided. Next, the length l (in the case of a square pixel) or arc y (inthe case of a circular pixel) of each sub-pixel is varied in oppositedirections along one axis only, in a staggered arrangement to eitherincrease or decrease the total area of the full pixel, depending uponthe particular pattern design being generated, as shown in FIGS. 5 a-band 6 a-b, respectively. In this regard, the area of each sub-pixel 21 aand 21 b should be linearly varied to an amount that is equal to or lessthan the minimum resolvable pitch of the optical system of the exposuretool being used. Additionally, where only a small number of sub-pixelsare arrayed to form the BHT photomask design, it is preferable that thepixels 19 are sized to meet the minimum resolution of the exposure toolbeing used to ensure that the sub-pixels 21 a and 21 b will not beresolved during the image writing process, and thus, avoid thesub-ripple effects exhibited by the prior art. Each modified pixel 19 ishereinafter referred to as a Half-Pitch Expansion Cell (“HPEC”). Thisprocess is repeated, with a series of HPECs being arrayed in a manner toreflect the design of the three-dimensional device to be fabricated. Byarraying the HPECs in this manner, continuous gray levels are createdsuch that the change in light intensity between each gray level (i.e.,amplitude) is both linear and finite. In this regard, since the numberof possible gray levels in the patterned array is increased by thismethod, the BHT mask design achieves a substantially continuous,variable pixel size from the maximum opening to the smallest opening toyield 100% to 0% transmission through the mask. As a result, smoothersurfaces are created on the three-dimensional object being formed withthe BHT photomask.

The arrayed design is created as a hierarchical, two-dimensional imagewritten within a Computer Aided Design (“CAD”) system. Any CAD toolhaving all-angle polygon capability can be used to write the pixels 19for the purposes of the present invention. One example of an appropriatea mask pattern generator to write a pixel is the L-Edit CAD tool byTanner EA.

The hierarchical design created with the method of the present inventionincorporates a layer for each gray level and allows each HPEC to bearrayed uniquely from other gray levels. This hierarchical design isused to compile a mask pattern generator file for writing the BHTpattern on a photomask, with the hierarchy being maintained in suchfile. By using this method, the mask pattern generator file size remainsvery small compared to one that has been flattened where all gray levelpixels are within a single layer, as is the case using prior artmethods. As a result, it is possible to achieve a quicker write time,thereby reducing the cost to manufacture the photomask. Furthermore, ithas been found that BHT layouts designed by the method of the presentinvention are more easily arrayed with a repeating symmetry that lendswell to polar and orthogonal arrays without interference from onesub-pixel to another. In this regard, unlike the prior art, whichrequired a pattern to be rewritten each time it was transferred to awafer, the method of the present invention allows a pattern to betransferred in a serial manner once it is arrayed. This too results infaster processing time to manufacture the resulting devices, and thus,greater throughput.

Furthermore, by forming the HPECs in accordance with the method of thepresent invention, the sub-pixels 21 a and 21 b should be below theminimum resolution of most optical systems of exposure tools. Thus,unlike the prior art, the BHT design made in accordance with the presentinvention is limited only by the CAD tool design grid that is chosen toarray the mask pattern (which is typically 1 nm, but may be other sizesif desired) and the CAD tool being used. Moreover, as should beunderstood from the foregoing, the sub-pixels 21 a and 21 b are createdas a single cell within a design having a width which can be modulatedfor each gray level, while at the same time maintaining a constant pitchfor that gray level. Thus, when each sub-pixel 21 a and 21 b is arrayedwith a layer and each gray level has an assigned layer, the single cellopen area can be easily changed for the photoresist process whencorrection for process non-linearity are required.

In the second, related aspect of the present invention, the mask patterngenerator file is transferred to a photomask. In this regard, a blankphotomask is made using a standard binary (e.g., chrome-on-quartz)photomask and conventional lithography techniques, as shown in FIG. 4.Preferably, the blank binary photomask is a standard chrome-on-quartzphotomask coated with a photoresist layer 51. It is noted however, thatthe photomask may have other layers (e.g., an anti-reflective layer suchas CrO) if needed or desired. To process the photomask, designatedportions of the photosensitive material on the photomask are exposed tothe mask pattern generator in accordance with the BHT photomask designstored in the mask pattern generator file and the exposed portions ofthe photoresist are removed such that the chrome portions 53 are nolonger covered by the photoresist 51. Next, the uncovered chromeportions 53 are etched away using standard techniques (e.g., wet or dryetching), thereby exposing the quartz portions 55 underlying the areasof removed chrome 53. Thereafter, the remaining photoresist (i.e., theunexposed photoresist) is removed. The result is a BHT photomask havingthe BHT design etched thereon. The opaque portions 53 of the BHTphotomask attenuates the passage of light energy through the mask suchthat the transmitted light will have varying intensity as governed bythe photomask design.

In the third, related aspect of the present invention, the design forthe three-dimensional microscopic structure is transferred from the BHTphotomask to a wafer to form the desired three-dimensional structure. Inthis regard, the BHT photomask designed in accordance with the method ofthe present invention is placed between a wafer exposure tool (e.g.,stepper) or other lithographic camera and a wafer having photoresist(e.g. AZ 4400) deposited thereon. Light is then transmitted from thewafer exposure tool through the openings in the BHT photomask in auniform, substantially linear manner to produce a three-dimensionallight aerial image. The photoresist on the wafer is in turn exposed tothis three-dimensional aerial light image and developed to remove theexposed photoresist. As a result, a three-dimensional surfacecorresponding to the aerial image is formed in the photoresist. Next,the wafer is etched to a predetermined depth to correspond in shape tothe developed photoresist. As a result, a three-dimensional image,defined by the BHT photomask, is formed on the wafer.

To achieve optimal linear results in designing a BHT photomask inaccordance with the present invention, there are several design andprocessing considerations which a photomask designer should considerwhen designing a BHT photomask layout. In particular, the designershould consider the limitations of the CAD tool and write tool beingused as well as the limitations of the wafer device being used tofabricate the three-dimensional device. Each of these considerations arediscussed below. However, it is noted that there may be other designconsiderations (e.g., active device tolerances and system resolutionneeded to accurately reproduce the active device) depending upon the BHTprocess being used and the device being made which a photomask designermay consider.

As noted herein, a variety of different CAD tools may be used, providedthat such CAD tools have all-angle capability. Thus, depending upon theCAD tool being used, the size of design grid may vary. Likewise,depending upon the mask pattern generator being used, the size of thewrite grid may also vary. For example, at the present time, conventionalmask write grid values are typically even multiples of the design grid,both of which generally range between 5 nm and 200 nm. It should benoted, however, that the design and write grid value can also be othervalues (e.g., 0.1 nm, 1.5 nm, etc), including for example, non-integers,fractions, etc. In such cases, the design grid and gray level pixel sizevariation would need to be adjusted to fit the write tool grid in orderto minimize the snap-to-grid that occurs when the design data isconverted into the write tool grid format. Thus, the present inventionis not limited to the write tools and write grids described herein, asthese tools are merely described for exemplary purposes. In a preferredembodiment, when a BHT photomask design is patterned onto a photomasksubstrate, the design should be adjusted to fit the mask patterngenerator write grid. In this regard, it is preferred that the size ofthe write grid is equal to the size of the design grid. The number ofgray levels that are possible in the design is governed by the equation(2) as follows:# Gray Levels for BHT photomask design=D _(y) /W _(g)   (2)

where W_(g) is the writer grid value and D_(y) is the sub-pixel size.Referring to Table 1 below, the difference in area change for a writetool address, the possible number of gray levels for a design and thepixels' critical dimensions size at the minimum energy threshold E_(o)10% of area is shown for both the HPECs designed in accordance with themethod of the present invention as well as a conventional square pixellayout of the prior art. In this example, the pixel's size in each caseis 2.5 microns. TABLE 1 Variation of Pixel Area by Maximum Number PixelSizing of 1 Address Unit of Gray Levels CD at E_(o) Write Tool Address,nm Write Tool Address, nm 10% of Area 5 25 100 200 5 25 100 200 X YHalf-Pitch 0.20% 1.00%  4.00%  8.00% 400 80 20 10 500 1250 Square 0.80%3.96% 15.36% 29.44% 200 40 10  5 791  791As can be seen, when the HPEC is changed in only one axis, the change inarea is a linear function in multiples of the address unit. When thesquare pixel is changed in both axes, the change in area is anexponential function, with the address unit being the exponent. As aresult, there is a non-linear change using the square pixel method.Moreover, when the area of the HPEC is varied as described herein, thenumber of possible gray levels doubles for a given dynamic range ascompared with the square pixel method. Additionally, the light intensityis sufficiently low at the minimum energy threshold E_(o) such that thephotoresist will be unresolvable when exposed.

In addition to considering the number of gray levels that are possiblein a design, the mask designer should also consider whether it ispossible to actually transfer these gray levels to the wafer device forwhich the BHT design is being designed. In this regard, the maskdesigner should determine the dynamic range (e.g., total number of graylevels of the image) that can actually be printed to the wafer device,which is governed by the equation (3) as follows:# Gray Levels to be printed on wafer=X/G _(w)   (3)where x is the length of device and G_(w) is the width of an individualgray scale region. Since the design and write grid for CAD and writetools are measured in nanometers, the sub-pixel to sub-pixel variationand the number of gray levels possible is limited only by the waferdevice length X and not by the grid size W_(g). For example, if amicro-mirror is required to be X microns in length and the height isalso X microns, the resulting mirror angle will be 45 degrees after theresist exposure using a properly designed BHT photomask in accordancewith the present invention.

A photomask designer should also consider the specifications for thesurfaces of the micro-optical device being made. In this regard, surfaceroughness is a critical element in the optical efficiency of an opticalcomponent. Thus, if the number of gray levels in a photomask design isinsufficient across the area of the design, the light intensity imagewill exhibit discrete steps that may be intolerable for the application.This problem is particularly prevalent in applications where thickphotoresist is used and the device design includes rapid changes withinshort areas, as illustrated in FIG. 7. Thus, the photomask designershould consider the type of photoresist being used on the wafer informulating a BHT design. In this regard, each type of photoresistprocess exhibits a unique response to the aerial image of an opticalexposure tool. For example, various changes in the photoresist'sthickness, bake conditions, dyes and absorption coefficients can changethe photoresist contrast or the slope of the contour of the BHTphotomask.

Accordingly, under a preferred embodiment of the present invention, themask designer should determine the dynamic range of the photoresistprocess being used. The dynamic range of the photoresist process is therange of the size of sub-pixels 21 a and 21 b. The dynamic range of thephotoresist process should preferably vary from the minimum sub-pixelopening required to achieve the minimum energy threshold E_(o) in thephotoresist to the largest sub-opening required to achieve the maximumenergy threshold E_(f) (i.e. dose-to-clear) in the photoresist. It iswithin the dynamic range E_(o)-E_(f) that the gray scale variationsshould be applied.

In many cases, these responses with the dynamic range E_(o)-E_(f) willnot be realized until after the BHT photomask is used and a calibratedresponse is observed with a particular design. Thus, it may benecessary, depending upon the BHT photomask design and the experience ofthe photomask designer, to fabricate a test BHT photomask and measureits response. Thereafter, a control design can be used to normalize thephotoresist to a linear response, where the pixel size variation iscalculated to be an equal change in transmitted light intensitythroughout the gray levels. This process may require one or moreiterations, depending upon the initial linearity achieved through thedesign. It should be noted, however, that as the mask designer becomesmore experienced with this method and learns how certain photoresistmaterials react in response to certain designs, it may not be necessaryto normalize the control design as more accurate results can be achievedfrom the initial design. Where measured and calibrated responses arerequired to fine tune the BHT photomask design, the mask designer shouldconsider that the amplitude of transmitted light through asub-resolution opening (e.g., sub-pixels 21 a and 21 b) is proportionalto the area of the opening. Accordingly, since the light intensitytransmitted through the opening is proportional to the magnitude squaredof the amplitude (i.e., I∞|A|²), then a linear change in wafer planeintensity is calculated by equation (4) as follows:|A|∞I^(1/2)   (4)where A is the amplitude of the light at the mask plane and I is theintensity of the light at the wafer plane. Thus, when the sub-pixel ischanged in one axis, there will be a linear change in intensity. It isnoted that further calibration may be needed in cases where it isnecessary to align three-dimensional features with two dimensionalfeatures in the same photomask. After photoresist calibration iscompleted, the variance from an expected response is measured. Thesevalues are then used to change the BHT photomask design, where eachsub-pixel's size in each of the gray levels of the design is eitherenlarged or reduced in area in one axis only, in accordance with thedisclosed method, to create the desired resist profile. As shown in FIG.8, as the photoresist contrast decreases, the dynamic range of thephotoresist process becomes wider. That is, the dynamic rangeE_(o)-E_(f) of the photoresist process changes with changes in thephotoresist contrast C as well as changes in the minimum resolution ofthe optical system being used. Thus, the wider the dynamic range, thegreater the number of gray levels possible within a BHT design.

Additionally, the photomask maker should consider the type of opticalsystem in the exposure tool that will be used to make thethree-dimensional device. In this regard, it is preferable to use anoptical system that has a high reduction ratio so as to enable the maskmaker to print sub-pixels throughout the dynamic range and within thelatitude of the photomask making process. Additionally, as the pixelsize of the design decreases, write tools and processes having higherresolutions may be required, which can drive up the cost of the process.Thus, to avoid this problem, it is preferable to use a photoresistprocess having as large a dynamic range as possible, a relatively lowcontrast photoresist (e.g., AZ-4400 photoresist can be used to producemirrors and lenses in single mode clad/core/clad polymer waveguides) andan optical system having a relatively low numerical aperture and highmagnification. If, by contrast, the wafer has requirements to patternvery small structures, then a higher NA and/or lower process resolutionvariation K1 should be used, and the BHT photomask design should bemodified to perform under these conditions. Additionally, if necessary,the wafer designer can use multiple mask levels and double exposuretechniques at different NAs to achieve the optimum results.

AZ-4400 photoresist has been shown to exhibit desirable transparency andphotosensitivity at 365 nm. Referring to Table 2, typical flow for aprocess using the AZ-4400 resist is shown: TABLE 2 Spin coat SoftbakeExpose PEB Develop Rinse Spin dry Temp RT 90 C. 240 mj 110 C. 20 C.Gently RT Time As required 60 sec  60 sec  3 min As required Speed Asrequired Bath As required Chemistry AZ-4400 AZ-300 MIF DiH20It is noted that care should be exercised in developing a photoresistcoating process so as to avoid a sunburst striation pattern, whichtypically occurs in thick photoresist coatings. Further, the smallthickness variations present in photoresist striations will bereproduced in the three-dimensional structures. Furthermore, the processcontrast can be reduced by under-baking the photoresist. It was foundthat a post-exposure bake worked well to diffuse the photoresistdevelopment inhibiter, minimizing the patterning of the binary halftonestep transitions.

Having described the overall method for designing and fabricating a BHTphotomask and design considerations regarding the same, specificexamples of the application of the method of the present invention arenow described.

Referring to FIG. 9, one embodiment of a BHT photomask design made inaccordance with the method of the present invention is shown. Moreparticularly, the gray levels in the design of FIG. 9 provide a ramplayout for a 45 degree micro-mirror, arrayed waveguide. When using theBHT photomask design of FIG. 9 and HPEC design method shown in FIGS. 5 aand 5 b with a 365 nm optical tool having an NA of 0.4 and a sigma of0.7, the BHT photomask transmitted light through its openings in acontinuous, linear fashion. Accordingly, photoresist on the wafer, whenexposed, resulted in a substantially smooth and linear profile, as shownin the SEM of FIG. 10. The wafer was then etched to a predetermineddepth to correspond to this resist profile. As shown in FIG. 11, a rampof 45 degree ±2 degrees (the actual measure angle was approximately 46.5degrees) was printed on the wafer for this particular photonicsapplication. Additionally, the resulting surface on the wafer wassufficiently smooth for this particular photonic applications, as thesurface roughness was less than 20 nm, as shown in FIG. 11. Furthermore,in this embodiment, the mean slope (46 degrees) curvature and notchingwere accurately predicted through simulations of the BHT photomaskdesign, as shown in FIG. 12. More particularly, as shown in FIG. 12, thesimulations for this embodiment predicted the following: an angle of89.74 degrees for the profile of this design between lines 71 and 73 awhere the horizontal and vertical changes in the profile were 166 nm and7.214 ÿ, respectively; an angle of 46.5 degrees for the profile of thisdesign between lines 73 a and 73 b where the horizontal and verticalchanges were 3.689 μm and 3.501 μm, respectively; and an angle of 88.52degrees for the profile of this design between lines 75 a and 75 b wherethe horizontal and vertical changes were 196 nm and 5.050 nm,respectively.

FIG. 13 shows another embodiment of a BHT mask design made from thepolar coordinate array made in accordance with the method of the presentinvention. This mask design could be used, for example, to fabricatemicro-optical components, such as a micro-lens or a conical section. Inthis embodiment, a lens was printed using the circular BHT photomaskdesign of FIG. 13 and the HPEC design methods of the present inventionas shown in FIGS. 6 a and 6 b. This particular BHT photomask was usedwith a 365 nm optical tool having an NA of 0.4 and a sigma of 0.7. Asubstantially smooth and linear photoresist profile was formed usingthis design, as shown in the AFM images of FIGS. 14 and 15. As can beseen, conical section objects were produced and exhibited no sub-rippleeffect in the device.

In another embodiment, the HPEC method of the present invention was usedto print a specific sloped structure for a photonic application. In thisembodiment, an Applied Materials ALTA 3500 laser writer was used on a 5nm write grid. The ALTA 3500 laser writer was the best choice for thisembodiment because it had a pixel-to-pixel critical dimension linearityat the wafer dimension which was similar to the write tool grid size. Itis noted, however, that in other applications, more advanced e-beam andlaser mask pattern generators (e.g., a CORE 2564, MEBES 4500 E-beamtool, etc.) having smaller grid sizes (e.g., 1.5 nm-2.5 nm) may also beused provided that the BHT photomask design can be fitted to the writetool grid and the desired gray levels can be achieved. Additionally, inthis embodiment, a dry plasma chrome etch was used to process the BHTphotomask. It is noted, however, wet etch techniques may bealternatively used. In such cases, response fidelity and gray scaleperformance will be limited by the write tool grid, and compromised bythe mask bias. Irrespective of which etching technique and mask writetool is used, the linearity in the critical dimensions of the designmust be maintained. Thus, to the extent the design exhibitsnon-linearity, such design should be corrected after the calibration ofthe wafer process is completed and compensated for in the BHT design. Byusing this type of process, mask dimensions can be controlled in alinear fashion for small sub-pixel sizes ranging from 0.4 μm to the fullpixel size of 2.5 μm when the ALTA 3500 write tool is used.

In another embodiment, the HPEC method of the present invention is usedto develop step and flash templates. In this regard, a BHT photomask ismade in accordance with the HPEC design method of the present invention.Thereafter, the three-dimensional image defined by the photomask istransferred in a reduction lithography system to a second substrate toproduce a second photomask with continuous tone (i.e., gray scale)patterns. This second mask serves as an imprinting or stamping templatefor imprint lithography applications. The second photomask shouldpreferably be made from a rigid material capable of operating as astamp. For example, the second photomask may be made from a variety ofdifferent rigid materials, including, but not limited to, fused silica,glass, metals, crystalline structures, plastics and any other rigidmaterial now known or hereinafter developed. In this embodiment, thesecond photomask is used to stamp or mold a three-dimensional structure.This may be done using an imprint stepper such as a Molecular Imprintsstepper or other known or hereinafter developed tools.

Now that the preferred embodiments of the present invention have beenshown and described in detail, various modifications and improvementsthereon will become readily apparent to those skilled in the art. Forexample, in addition to designing BHT photomasks, the HPEC method of thepresent invention could be modified to design gray scale photomasks(e.g., 0%, 50%, 100%, etc. transmissivity) to be used to makethree-dimensional microscopic structures. Additionally, it is noted thateach pixel can be divided into thirds, quarters, fifths, etc. to formthree, four, five, etc. sub-pixels, respectively. In such cases, thearea of each sub-pixel should be varied along one axis only inaccordance with the methods described herein. For example, as shown inFIG. 16, a pixel 19 can be sub-divided in 4 sub-pixels 21 a, 21 b, 21 cand 21 d. In this example, each sub-pixel 21 a-d is sub-divided to beone half of the pitch of the pixel 19 in a first axis with the width ofeach sub-pixel 21 a-d being varied along a second axis. Moreover, it isnoted that the HPECs designed in accordance with the method of thepresent invention could be combined on a photomask with other devicedesigns (e.g., two dimensional binary structures such as an integratedcircuit). The present embodiments are therefor to be considered in allrespects as illustrative and not restrictive, the scope of the inventionbeing indicated by the appended claims, and all changes that come withinthe meaning and range of equivalency of the claims are thereforeintended to be embraced therein.

1. A microscopic three-dimensional structure comprising: a wafer havinga continuous tone, substantially linear and smooth surface, said surfaceof said wafer corresponding to the shape of a light aerial imagegenerated from a binary half tone photomask, said photomask comprising apattern formed therein, said pattern defined by at least one pixel,wherein each pixel is divided into sub-pixels having a variable lengthin a first axis and fixed length in a second axis.
 2. The microscopicthree-dimensional structure of claim 1, wherein said sub-pixels eachhave an area which is smaller than the minimum resolution of an opticalsystem of an exposure tool with which said binary half tone photomask isintended to be used.
 3. The microscopic three-dimensional structure ofclaim 1, wherein said at least one pixel is a square.
 4. The microscopicthree-dimensional structure of claim 3, wherein said sub-pixels have aheight, a length and a pitch, said height of each of said sub-pixelsbeing approximately one-half of said pixel's pitch and said length ofeach sub-pixel being linearly varied in opposite directions along oneaxis only.
 5. The microscopic three-dimensional structure of claim 3,wherein said sub-pixels have a height, a length and a pitch, said heightof each of said sub-pixels being approximately one-third, one-fourth orone-fifth of said pixel's pitch and said length of each sub-pixel beinglinearly varied in opposite directions along one axis only.
 6. Themicroscopic three dimensional device of claim 3, wherein said squarepixels are arrayed to form a layout for a photonic application.
 7. Themicroscopic three-dimensional structure 4, wherein said layout is a ramplayout.
 8. The microscopic three-dimensional structure of claim 4,wherein an exposure tool that transmits light at 365 nm, has an NA of0.4 and sigma of 0.7 is used.
 9. The microscopic three-dimensionalstructure of claim 1, wherein said pixel is circular.
 10. Themicroscopic three-dimensional structure of claim 9, wherein saidsub-pixels have a radius, an arc length and a pitch, said radius of eachof said sub-pixels being approximately one-half of said pixel's pitchand said arc length of each sub-pixel being linearly varied in oppositedirections along one axis only.
 11. The microscopic three-dimensionalstructure of claim 9, wherein said sub-pixels have a radius, an arclength and a pitch, said radius of each of said sub-pixels beingapproximately one-third, one-fourth or one-fifth of said pixel's pitchand said arc length of each sub-pixel being linearly varied in oppositedirections along one axis only.
 12. The microscopic three-dimensionalstructure of claim 10, wherein said circular pixels are arrayed to forma conical ramp layout.
 13. The microscopic three-dimensional structureof claim 10, wherein an exposure tool that transmits light at 365 nm,has an NA of 0.4 and a sigma of 0.7 is used.
 14. A method forfabricating a three-dimensional microscopic structure comprising thesteps of: providing a binary half tone photomask between an exposuretool and a wafer coated with a photoresist layer, said binary half tonephotomask comprising a substantially transparent substrate, an opaquelayer having a pattern formed therein, said pattern defined by at leastone pixel, wherein each pixel is divided into sub-pixels having avariable length in a first axis and a fixed length in a second axis; andexposing the photoresist layer of said wafer to the exposure tool inaccordance with said pattern on the binary half tone photomask.
 15. Themethod of claim 14, further comprising the step of removing undesiredphotoresist to form a three-dimensional profile in the photoresist whichhas not been removed.
 16. The method of claim 15, further comprising thestep of etching said wafer to a predetermined depth to correspond inshape to the three dimensional profile formed in said remainingphotoresist.
 17. The method of claim 14, wherein each of said sub-pixelshas an area which is smaller than the minimum resolution of an opticalsystem of an exposure tool with which said binary half tone photomask isintended to be used.
 18. The method of claim 14, wherein said pixel is asquare.
 19. The method of claim 18, wherein said sub-pixels have aheight, a length and a radius, said height of each of said sub-pixelsbeing approximately one-half of said pixel's pitch and said length ofeach sub-pixel being linearly varied in opposite directions along oneaxis only.
 20. The method of claim 19, wherein said sub-pixels have aheight, a length and a radius, said height of each of said sub-pixelsbeing approximately one-third, one-fourth or one-fifth of said pixel'spitch and said length of each sub-pixel being linearly varied inopposite directions along one axis only.
 21. The method of claim 14,wherein said pixel is circular.
 22. The method of claim 21, wherein saidsub-pixels have a radius, an arc length and a pitch, said radius of eachof said sub-pixels being approximately one-half of said pixel's pitchand said arc length of each sub-pixel being linearly varied in oppositedirections along one axis only.
 23. The method claim 21, wherein saidsub-pixels have a radius, an arc length and a pitch, said radius of eachof said sub-pixels being approximately one-third, one-fourth orone-fifth of said pixel's pitch and said arc length of each sub-pixelbeing linearly varied in opposite directions along one axis only.
 24. Amethod for making step and flash templates comprising the steps of:providing a binary photomask having a photoresist layer, an opaque layerand substantially transparent in a lithography tool; exposing thephotoresist layer to a lithography tool in accordance with a binary halftone photomask pattern, wherein said pattern is defined by at least onepixel, wherein each pixel is divided into sub-pixels having a variablelength in a first axis and fixed length in a second axis; removingundesired portions of said photoresist; etching portions of said chromelayer underlying said removed photoresist portions; removing undesiredportions of the photoresist layer; and transferring the pattern in saidbinary half tone photomask to a second substrate to produce a continuoustone pattern defined by the photomask thereon.
 25. The method of claim24, wherein said step of transferring is performed using a reductionlithography system.
 26. The method of claim 24, wherein said secondsubstrate is made from a rigid material.
 27. The method of claim 25,wherein said second substrate is made from the group consisting of fusedsilica, glass, metals, crystalline structures and plastics.
 28. Themethod of claim 24, further comprising the step of using said secondsubstrate as an imprinting or stamping plate for fabricating imprintlithography applications.
 29. A microscopic three-dimensional structurecomprising: a wafer having a continuous tone, substantially linear andsmooth surface, the surface of the wafer corresponding to the shape of alight aerial image generated from a gray scale photomask, the photomaskcomprising a pattern formed therein, the pattern defined by at least onepixel, wherein each pixel is divided into sub-pixels having a variablelength in a first axis and fixed length in a second axis.
 30. Themicroscopic three-dimensional structure of claim 29, wherein each of thesub-pixels have an area which is smaller than the minimum resolution ofan optical system of an exposure tool with which the binary half tonephotomask is intended to be used.
 31. The microscopic three-dimensionalstructure of claim 29, wherein the at least one pixel is a square. 32.The microscopic three-dimensional structure of claim 31, wherein thesub-pixels have a height, a length and a pitch, the height of each ofthe sub-pixels being approximately one-half of the pixel's pitch and thelength of each sub-pixel being linearly varied in opposite directionsalong one axis only.
 33. The microscopic three-dimensional structure ofclaim 31, wherein the sub-pixels have a height, a length and a pitch,the height of each of the sub-pixels being approximately one-third,one-fourth or one-fifth of the pixel's pitch and the length of eachsub-pixel being linearly varied in opposite directions along one axisonly.
 34. The microscopic three dimensional device of claim 31, whereinthe square pixels are arrayed to form a layout for a photonicapplication.
 35. The microscopic three-dimensional structure of 29,wherein the layout is a ramp layout.
 36. The microscopicthree-dimensional structure of claim 29, wherein an exposure tool thattransmits light at 365 nm, has an NA of 0.4 and sigma of 0.7 is used.37. The microscopic three-dimensional structure of claim 29, wherein thepixel is circular.
 38. The microscopic three-dimensional structure ofclaim 37, wherein the sub-pixels have a radius, an arc length and apitch, the radius of each of said sub-pixels being approximatelyone-half of the pixel's pitch and the arc length of each sub-pixel beinglinearly varied in opposite directions along one axis only.
 39. Themicroscopic three-dimensional structure of claim 37, wherein thesub-pixels have a radius, an arc length and a pitch, the radius of eachof the sub-pixels being approximately one-third, one-fourth or one-fifthof the pixel's pitch and the arc length of each sub-pixel being linearlyvaried in opposite directions along one axis only.
 40. The microscopicthree-dimensional structure of claim 38, wherein the circular pixels arearrayed to form a conical ramp layout.
 41. The microscopicthree-dimensional structure of claim 38, wherein an exposure tooltransmits light at 365 nm, has an NA of 0.4 and a sigma of 0.7 is used.42. A method for fabricating a three-dimensional microscopic structurecomprising the steps of: providing a gray scale photomask between anexposure tool and a wafer coated with a photoresist layer, the grayscale photomask comprising a substantially transparent substrate, anopaque layer having a pattern formed therein, the pattern defined by atleast one pixel, wherein each pixel is divided into sub-pixels having avariable length in a first axis and a fixed length in a second axis; andexposing the photoresist layer of the wafer to the exposure tool inaccordance with the pattern on the gray scale photomask.
 43. The methodof claim 42, further comprising the step of removing undesiredphotoresist to form a three-dimensional profile in the photoresist whichhas not been removed.
 44. The method of claim 43, further comprising thestep of etching the wafer to a predetermined depth to correspond inshape to the three dimensional profile formed in the remainingphotoresist.
 45. The method claim 42, wherein said sub-pixels' area issmaller than a minimum resolution of an optical system of an exposuretool with which said binary half tone photomask is intended to be used.46. The method claim 42, wherein the pixel is a square.
 47. The methodclaim 46, wherein the sub-pixels have a height, a length and a pitch,the height of each of the sub-pixels being approximately one-half of thepixel's pitch and the length of each sub-pixel being linearly varied inopposite directions along one axis only.
 48. The method claim 46,wherein the sub-pixels have a height, a length and a pitch, the heightof each of the sub-pixels being approximately one-third, one-fourth orone-fifth of the pixel's pitch and the length of each sub-pixel beinglinearly varied in opposite directions along one axis only.
 49. Themethod claim 42, wherein the pixel is circular.
 50. The method claim 49,wherein the sub-pixels have a radius, an arc length and a pitch, theradius of each of the sub-pixels being approximately one-half of thepixel's pitch and the arc length of each sub-pixel being linearly variedin opposite directions along one axis only.
 51. The method claim 49,wherein the sub-pixels have a radius, an arc length and a pitch, theradius of each of the sub-pixels being approximately one-third,one-fourth or one-fifth of the pixel's pitch and the arc length of eachsub-pixel being linearly varied in opposite directions along one axisonly.
 52. A combined binary/binary halftone photomask comprising: asubstantially transparent substrate; at least one binary halftoneportion comprising an opaque layer having a pattern formed therein, thepattern defined by at least one pixel, wherein each pixel is dividedinto sub-pixels having a variable length in a first axis and a fixedlength in a second axis; and at least one binary portion comprising atleast one opening formed in the opaque layer.
 53. A combined binary/grayscale photomask comprising: a substantially transparent substrate; atleast one gray scale portion comprising an opaque layer having a patternformed therein, the pattern defined by at least one pixel, wherein eachpixel is divided into sub-pixels having a variable length in a firstaxis and a fixed length in a second axis; and at least one binaryportion comprising at least one opening formed in the opaque layer. 54.A method of forming a gray scale photomask comprising: providing aphotomask blank comprising a substantially transparent substrate and anopaque layer; generating an hierarchical, multi-layered, two-dimensionalimage within a computer-aided design system, each layer of the imagecorresponding to a respective gray scale level; and forming a pattern inthe opaque layer in accordance with the generated image, the patterndefined by at least one pixel, wherein each pixel is divided intosub-pixels having a variable length in a first axis and a fixed lengthin a second axis, the first axis length of the sub-pixels varying basedon the gray scale level.
 55. The method of claim 54, wherein the patternis formed in the opaque layer in a serial manner.
 56. A method offorming a binary halftone photomask comprising: providing a photomaskblank comprising a substantially transparent substrate and an opaquelayer; generating an hierarchical, multi-layered, two-dimensional imagewithin a computer-aided design system, each layer of the imagecorresponding to a respective gray scale level; and forming a pattern inthe opaque layer in accordance with the generated image, the patterndefined by at least one pixel, wherein each pixel is divided intosub-pixels having a variable length in a first axis and a fixed lengthin a second axis, the first axis length of the sub-pixels varying basedon the gray scale level.
 57. The method of claim 56, wherein the patternis formed in the opaque layer in a serial manner.